This is a semiconductor process that polishes the wafer using chemical and mechanical measures for flat surface.
Application
· W, Cu, OXIDE
Specification
· High Throughput for Process
· Dual Polishing & Cleaner
· Carrier moving on (Chuttle) track system
· 4FOUP, 1 Metrology
Feature
· Easy Maintenance & Operation
· Left & Right Independent Operation
· Small Footprint
