Wafer를 화학적 반응(Chemical)과 기계적 힘(Mechanical)을 이용하여 평탄하게 연마(Polishing)하는 반도체 공정입니다.
Application
· W, Cu, OXIDE
Specification
· High Throughput for Process
· Dual Polishing & Cleaner
· Carrier moving on (Chuttle) track system
· 4FOUP, 1 Metrology
Feature
· Easy Maintenance & Operation
· Left & Right Independent Operation
· Small Footprint
Equipment Sales Team : 장비 사양 및 견적 문의 ( equipsales@kctech.co.kr)
